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Reliability Analysis for Multiple Dependent Failure Processes: An MEMS Application

SC IJPE 18

Qianmei Feng1 and David W. Coit2

1 Department of Industrial Engineering, University of Houston, Houston, TX, USA
2 Department of Industrial & Systems Engineering, Rutgers University, Piscataway, NJ, USA

Received on: March 23, 2009

 

Abstract:

Widespread acceptance of micro-electro-mechanical systems (MEMS) depends highly on their reliability, both for large-volume commercialization and for critical applications. The problem of multiple dependent failure processes is of particular interest to MEMS researchers. For MEMS devices subjected to both wear degradation and random shocks that are dependent and competing, we propose a new reliability model based on the combination of random-shock and degradation modeling. The models developed in this research can be applied directly or customized for most current and evolving MEMS designs with multiple dependent failure processes.

 

Status: Published in Vol. 6, No. 1, January 2010, pp.100-102.

 

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